CRC-ACS Postgraduate Scholarship

Scholarship Description

Quickstep has emerged as a strong contender to replace the traditional autoclave curing for advanced polymer composites. In the process, the laminate stack is laid-up on a single-sided mould that is sealed in a vacuum bag and placed into a low pressure chamber heated by a heat transfer fluid (HTF). High heating and cooling rates during a curing cycle can be achieved due to good convective heat transfer between the floating mould and the HTF. A number of issues in heat transfer and cure will inevitably become very important due to the fast nature of the process. These include heat transfer from the HTF to the mould, heat transfer inside the mould assembly, and heat transfer in the composite laminates being manufactured and exothermic cure reaction of the laminate. The proposed thesis project will investigate heat transfer and cure characteristics of the Quickstep process through both numerical prediction and experimental characterisation.

Reference Number:	3606
Study Subject:	Heat Transfer & Cure Analysis of Quickstep Process
Web Address:	http://www.eng.uq.edu.au/people.asp?username=uqmhou§ion=theses
Provided By:	School of Engineering
To be undertaken at:	The University of Queensland.
Level:	Post Graduate (Research)

Availability

This scholarship is offered once only to one person. Open for applications from January 20, 2008.

Payment Information

The value of this scholarship is AUD26140 (per annum). This award is to be used for research, living expenses and fees. This scholarship is paid monthly for the period of 3 years.

Research Information

This scholarship is for one of the following fields of research: Aerospace engineering, ENGINEERING AND TECHNOLOGY, Manufacturing engineering or Materials engineering.

Eligibility

This scholarship is for study in Australia. You must be between the age of 21 and 30. There are no restrictions on citizenship.

Application Details

To apply for this scholarship you must apply directly to the scholarship provider. Terms and conditions are subject to change. Always confirm details with scholarship provider before applying.